| Composition | Sn99/Ag0.3/Cu0.7 |
| Brand | BOND |
| RoHS/Non-RoHS | RoHS |
| Particle Size (µm ) | T4(20-38 μm) |
| Shape | SPHERICAL |
| Flux Content | 11.5 ± 0.5% |
| Viscocity | 200 ±030.0 Pa.s |
| Copper Corrosion Test | PASSED |
| Shelf Life | 6 months |
| Storage | Below 10℃ |
Similar Products
| Composition | Sn99/Ag0.3/Cu0.7 |
| Brand | BOND |
| RoHS/Non-RoHS | RoHS |
| Particle Size (µm ) | T4(20-38 μm) |
| Shape | SPHERICAL |
| Flux Content | 11.5 ± 0.5% |
| Viscocity | 200 ±030.0 Pa.s |
| Copper Corrosion Test | PASSED |
| Shelf Life | 6 months |
| Storage | Below 10℃ |
