RoHS Solder stick
Lead free Solder Stick LF9 - Sn99.3 / Cu0.37
Lead free Solder Stick LF9 - Sn99.3 / Cu0.37
Composition | Sn99.3/Cu0.7 |
Type | RoHS |
Melting Point | 227 ºC |
Specific Gravity | 7.4 |
TENSILE STRENGTH(Mpa/min) | 32 |
Application | General purpose lead free alloy for soldering of electrical / electronics components and pcbs |
Similar Products